S-Multi
MINGDA S-Multi is fast and easy to peel support materials, by adjusting the support surface of the main material bonding strength and S-Multi self-bonding strength to achieve fast and easy peeling function. S-Multi quickly and easily removes support materials without using water or solvent in the process of removing support, which does not produce water pollution and is safe and environmental protection. MINGDA S-Multi can be applied to dual nozzle FDM printers or two-in, one-out FDM printers.
● Rapid removal
● Safety and environmental protection
Applications:
● Support material for Engineering Filaments
● For large overhangs and cavities
● Easy to remove and break-away
● Smooth and clean support interface
Recommended Print Settings
Nozzle temperature (°C)
260-280 °C
Build platform temperature (°C)
60-80℃
Printing speed (mm/s)
30-120 mm/s
Cooling fan
Off
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